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Data set: Etching of wafer, etching gases mix, semiconductor industry average (00.00.001)

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Full name Etching of wafer, etching gases mix, semiconductor industry average; etching; production mix

Location KR

Reference year 2023

Valid until 2027

Reference flow(s) 12인치 웨이퍼(반제품) - 1.0 * 1.0 piece (EACH)

Type LCI result

Parameterized? no

LCIA results included? no

Category Materials production / Other materials

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General comment In the semiconductor manufacturing process, the etching process is a core unit process following the photolithography process that selectively removes unnecessary oxide layers on the wafer to form circuit patterns. Etching is broadly divided into wet etching and dry etching. Wet etching uses a liquid chemical solution to induce a chemical reaction that dissolves and removes specific areas. On the other hand, dry etching utilizes reactive gases or ions in a plasma state to physically and chemically etch the surface, offering superior characteristics for realizing fine patterns.

LCI Method Principle Attributional

LCI Method Approaches Other Allocation - equal distribution

Completeness of product model All relevant flows quantified

Reviews Accredited third party review by No records found.

License and access conditions Copyright yes License type Free of charge for all users and uses

Owner of data set KIER

Technical purpose

Input Products No records found.

Co-Products No records found.

Data set version 00.00.001

Time stamp (last saved) 2026-08-14T15:47:47.000

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Registry name	Base URL	Status
GLAD	https://www.globallcadataaccess.org

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